Headline

Senior Thermal Engineer @ TE Connectivity /ex-AMD/ ex-IITM Research Park| Heat Sinks, Flotherm, Thermal Simulations, Electronics Cooling, Icepak, Fluid Mechanics

About

Currently serving as a Senior Research and Development Engineer at TE Connectivity, contributing expertise in thermal analysis, thermal modeling, and joule heating to drive advancements in cooling solutions for Connectors, Busbars and auxiliary components in the Data Center Ecosystem. Over a decade of experience in mechanical and thermal engineering, specializing in the evaluation and simulation of thermal performance for electronic components and systems. Proficient in cutting-edge tools like Ansys, Icepak, and Flotherm, with a proven track record of designing and developing heat sinks, cold plates, and liquid cooling systems. Dedicated to optimizing thermal management solutions and enabling high-performance electronics through innovation, collaboration, and precision engineering.

Location

Greater Bengaluru Area

AI stack

gemini

openai

ChatGPT

ChatGPT Images

Microsoft Copilot

Work experience

Senior Research And Development Engineer at TE Connectivity, Jun 2026 - Present · 4 mos, Bengaluru

Principal Design Engineer at Insemi Technology Services Pvt. Ltd., Aug 2022 - Aug 2025 · 3 y, Whitefield Bangalore, • Contractor for Advanced Micro Devices, India o Thermal Simulation and Evaluation of Mother Boards and Daughter Cards o Thermal Simulation and Performance Analysis of Processors and Electronic Packages o Design and Development of Heatsinks and Performance Analysis through Simulation tools

Thermal Engineer at AMD, Aug 2020 - May 2026 · 5 yrs 10 mos, Bengaluru, Advanced Micro Devices, India o Thermal Simulation and Evaluation of Mother Boards o Joule Heating Simulations and Integration of SI/PI simulations with Thermal Simulations using Ansys HFSS/SIWave+Icepak. o Thermal Simulation and Performance Analysis of Processors and Electronic Packages o Design and Development of Heatsinks, Cold Plates, etc o Evaluation of Liquid Cooling Systems like cold plates, heat pipes, etc and testing for thermal performance

Staff Design Engineer at Insemi Technology Services Pvt. Ltd., Aug 2020 - Jul 2022 · 2 yrs, Bengaluru, Karnataka, India

Mechanical Engineer at Systel, Inc. Rugged Computers, Dec 2019 - Jun 2020 · 7 mos, Navi Mumbai, Maharashtra, India, Flow and Thermal Simulations of Rack Mount Servers and Electronic devices using Ansys Icepak.

Simulation Engineer at AirOK technologies (P) Ltd, Apr 2018 - Oct 2019 · 1 yr 7 mos, Chennai, Tamil Nadu, India, • Air Purifier for Indoor Applications o Design and Development of CAD models and optimization to enhance the design for performance and aesthetics. o Air Flow Simulations to ensure spread/coverage of air to all areas of the room/test space. o Porous Media Simulations to evaluate quality of outlet air from the Air Purifier • Car Seat Integrated Air Purification Device (WIP) o Selection of optimal location of Air Purifier placement o Selection of Fans and filter media o Design and Development of CAD models in collaboration with an Automotive OEM to enhance the design for performance o Air Flow Simulations to ensure spread/coverage of air to all areas of car cabin o Porous Media Simulations to evaluate quality of outlet air from the Air Purifier • Mini Air Purifier for Enclosed Areas (Elevators, Cars, etc.) o Selection of optimal location of Air Purifier placement o Selection of Fans and filter media and shape o Design and Development of CAD models in collaboration with an Engineering OEMs to enhance the design for performance o Air Flow Simulations to ensure spread/coverage of air to all areas of the test space. o Porous Media Simulations to evaluate quality of outlet air from the Air Purifier

Education

Master of Engineering (M.Eng.), Thermal Engineering, BITS Pilani, Hyderabad Campus

Bachelor of Technology (B.Tech.), Mechanical Engineering, Anurag group of institutions