Headline

Thermal Engineer/CFD &CAE/Reliability

About

Thermal and CFD engineer with 13+ years in automotive electronics, currently leading CAE & CFD as R&D Manager at Napino Auto & Electronics — focused on high-reliability power electronics and semiconductor-based systems for automotive and EV applications. Thermal system design, CAE/CFD analysis, and multiphysics simulation drive the design, optimization, and validation of ECUs, BCMs, RR units, DC-DC converters, and battery chargers — translating simulation insight into semiconductor component selection, heat dissipation strategy, and system robustness across real-world operating conditions. Cross-functional teams across design, hardware, and validation are coordinated to keep DFMEA, structured test planning, vibration analysis, and field failure investigation feeding directly into design trade-offs and early risk mitigation — holding products to automotive reliability standards from concept through validation. Core strengths: → Electronics & power electronics thermal management → CFD, CAE, and multiphysics simulation (ANSYS Icepak, Fluent) → Semiconductor cooling and thermal architecture → Reliability engineering — Weibull analysis, DFMEA, warranty/field failure investigation → Cross-functional team leadership across design, hardware, and validation The throughline across 13+ years: compact, reliable, high-performing thermal solutions that hold up under automotive-grade stress — built through hands-on simulation expertise and, increasingly, through the teams and processes that scale that reliability across an entire product line.

Location

Gurugram

AI stack

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Work experience

R&D Manager: CAE & CFD at Napino Auto & Electronics Ltd, Jul 2020 - Present · 6 yrs 4 mos, Gurugram, Haryana, India, • Product Development and optimization of automotive electronic products such as ECUs, BCMs, RR Units, DC-DC Convertors, and battery chargers to enhance performance and reliability. • Optimized selection of semiconductor component configurations (ICs, MOSFETs, diodes, BGA) to improve heat dissipation in electronic systems. • Reviewed and evaluated designs and project activities for compliance with technology guidelines and development standards, providing actionable feedback to improve product quality. • Developed and maintained DFMEA, test plans, and procedures to ensure adherence to quality and performance requirements. • Assisted cross-functional project teams, including internal and external partners, across all stages of mechanical and thermal development, encompassing design, validation, tooling, and testing. • Provided domain-specific expertise and leadership in mechanical and thermal design, supporting cross-organizational projects and driving innovation in design and development processes. • Applied Finite Volume Method (FVM) and Finite Element Analysis (FEA) techniques to solve Stress Analysis, Vibrational and Explicit dynamics (Drop) Analysis. • Selection of Epoxy, TIM, PU, Thermal Greases, PAD for optimized thermal dissipation. • Independently planned, scheduled, and executed thermal computations and analysis, delivered technical presentations, and documented results in detailed reports. • Tested components in the laboratory using equipment such as thermal chambers, environmental shock chambers, and vibration tables to validate designs. • Managed and nurtured relationships with internal and external development partners to facilitate mechanical and thermal design and development projects. • Improved thermal performance of metal-class and FR4 PCBs by implementing advanced cooling strategies and optimizing design configurations.

Lead at Napino Auto & Electronics Ltd, Jan 2020 - Present · 6 yrs 10 mos, Led thermal and multi-physics CAE for EV + ICE automotive electronics (OBC, DC-DC, ECU, BMS, MCU, RR), supporting NPD from concept to validation. Owned electro-thermal simulations (ICEPAK/FloTHERM/Fluent) to predict component/assembly temperatures and drive thermal design decisions and packaging improvements. Owned thermal sign-off readiness and thermal risk closure for electronics modules by translating requirements into CAE targets and design actions. Improved thermal robustness by optimizing semiconductor configuration (ICs/MOSFETs/diodes/BGA) and defining effective heat dissipation pathways (TIM/heat spreaders/heat pipes/fans). Built automated CAE workflows to reduce simulation cycle time by ˜25%, enabling faster design iterations and improved engineering responsiveness. Delivered test-aligned development: created thermal measurement guidelines to reduce lab errors and strengthen simulation-to-test correlation confidence. Executed thermal validation using thermal/environmental shock chambers, IR imaging, data loggers, and vibration tables; ensured compliance to IEC/ISO/MIL/JASO/AIS/JEDEC/OEM standards. Managed and mentored a 13-member CAE team; governed HPC token allocation and license/cost renewals to ensure delivery and quality.

Deputy Manager at Napino Auto & Electronics Ltd, Jan 2022 - Jul 2024 · 2 yrs 7 mos, Manesar, Haryana, India

Lead at Entuple Technologies Pvt. Ltd., Feb 2019 - Oct 2019 · 9 mos, Greater Delhi Area

Assistant Manager-NPD at INNOVENT Engineering Solutions Pvt Ltd, Aug 2015 - Oct 2018 · 3 yrs 3 mos, Delhi

Senior Engineer-Fluids at INNOVENT Engineering Solutions Pvt Ltd, Oct 2013 - Aug 2015 · 1 yr 11 mos, Bangalore

Aerospace Engineer at P3 Group, Sep 2012 - Aug 2013 · 1 yr, Bengaluru, Karnataka, India

Design Engineer at Kinetix Engineering Solutions, May 2011 - Aug 2012 · 1 yr 4 mos, Bangalore, Handling CFD-related industrial analysis, Design calculations ( ASME standard) , stress calculations and analysis

Education

Bachelor of Technology (B.Tech.), Aerospace Engineering, UPES

Flight Mechanics Course, Aerospace, INDIAN INSTITUTE OF TECHNOLOGY KANPUR