Pranav Kadam profile photo 1 on Tal

Pranav Kadam

3D Geometry Processing, Compression & Standardization

San Francisco Bay Area

8+ years of work experience

Tencent
May 20233 yrs 2 mosPresent

Palo Alto, CA

Working on ongoing AOMedia VVM standard on Static Polygonal Mesh Coding. 3 major lossless coding tool adoptions with over 2% coding gain. Several other contributions adopted spanning across geometry prediction, connectivity regularization and entropy coding. Development and implementation of mesh processing algorithms including symmetry aware mesh analysis, UV-preserved mesh decimation and mesh registration.
Tencent
Feb 20234 mosMay 2023

Palo Alto, California, United States

Research and development of methods for symmetric mesh coding and use of registration techniques in mesh coding.
Sony
Aug 20225 mosDec 2022

San Jose, CA

Research and development of AI-based dynamic point cloud compression method and rate control technique. Proposed method led to an input contribution in MPEG AI-PCC standard.
InterDigital, Inc.
May 20224 mosAug 2022

New York, NY

Research and development of AI-based method for motion estimation and intra-/inter-mode decision in dynamic point cloud compression.
USC Viterbi School of Engineering
Aug 202110 mosMay 2022

Los Angeles, CA

EE 559 - Machine Learning I (Spring 2023) EE 569 - Introduction to Digital Image Processing (Spring 2022) EE 510 - Linear Algebra for Engineering (Fall 2021)
USC Viterbi School of Engineering
May 20193 yrs 1 moMay 2022

Los Angeles, CA

Research and development of methods for 3D geometry perception
USC Viterbi School of Engineering
Aug 20199 mosApr 2020

Los Angeles, California, United States

1. EE 569 - Introduction to Digital Image Processing (Spring 2020) 2. EE 562 - Random Processes (Spring 2020) 3. EE 567 - Communication Systems (Fall 2019)
IUCAA, Pune, India
Jun 20171 yrMay 2018

Pune

Research and development on detection of Gamma Ray Bursts from satellite time series data using machine learning techniques

Education

University of Southern California

Doctor of Philosophy - PhD, Electrical Engineering

University of Southern California

20203 yrs2023
University of Southern California

Master of Science (Honors) - MS, Electrical Engineering

University of Southern California

20182 yrs2020

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Headline

3D Geometry Processing, Compression & Standardization

About

Currently, I am a Senior Research Engineer at Tencent working with the Media Lab led by Shan Liu. My role involves research and development of 3D Graphics coding technologies for meshes and point clouds. I am also actively involved in standardization activities for 3D data. I earned my Ph.D. from University of Southern California (USC) where I was advised by C.-C. Jay Kuo. My dissertation was related to 3D perception from point cloud data using unsupervised machine learning techniques. Previously, I interned at Sony R&D Center USA and InterDigital Video Lab where I contributed to AI-based 3D point cloud compression exploration activities in MPEG. I also keep an interest in Computer Vision, Machine Learning and exploring emerging technologies in general.

Location

San Francisco Bay Area

Work experience

Senior Researcher at Tencent, May 2023 - Present · 3 yrs 2 mos, Palo Alto, CA, Working on ongoing AOMedia VVM standard on Static Polygonal Mesh Coding. 3 major lossless coding tool adoptions with over 2% coding gain. Several other contributions adopted spanning across geometry prediction, connectivity regularization and entropy coding. Development and implementation of mesh processing algorithms including symmetry aware mesh analysis, UV-preserved mesh decimation and mesh registration.

Research Intern at Tencent, Feb 2023 - May 2023 · 4 mos, Palo Alto, California, United States, Research and development of methods for symmetric mesh coding and use of registration techniques in mesh coding.

Applied Research Intern at Sony, Aug 2022 - Dec 2022 · 5 mos, San Jose, CA, Research and development of AI-based dynamic point cloud compression method and rate control technique. Proposed method led to an input contribution in MPEG AI-PCC standard.

Research Intern at InterDigital, Inc., May 2022 - Aug 2022 · 4 mos, New York, NY, Research and development of AI-based method for motion estimation and intra-/inter-mode decision in dynamic point cloud compression.

Teaching Assistant at USC Viterbi School of Engineering, Aug 2021 - May 2022 · 10 mos, Los Angeles, CA, EE 559 - Machine Learning I (Spring 2023) EE 569 - Introduction to Digital Image Processing (Spring 2022) EE 510 - Linear Algebra for Engineering (Fall 2021)

Research Assistant at USC Viterbi School of Engineering, May 2019 - May 2022 · 3 yrs 1 mo, Los Angeles, CA, Research and development of methods for 3D geometry perception

Course Grader at USC Viterbi School of Engineering, Aug 2019 - Apr 2020 · 9 mos, Los Angeles, California, United States, 1. EE 569 - Introduction to Digital Image Processing (Spring 2020) 2. EE 562 - Random Processes (Spring 2020) 3. EE 567 - Communication Systems (Fall 2019)

Research Intern at IUCAA, Pune, India, Jun 2017 - May 2018 · 1 yr, Pune, Research and development on detection of Gamma Ray Bursts from satellite time series data using machine learning techniques

Education

Doctor of Philosophy - PhD, Electrical Engineering, University of Southern California

Master of Science (Honors) - MS, Electrical Engineering, University of Southern California