Trainee | VLSI | Digital Physical Design Enthusiast | Learning Physical Implementation Flow|*Electronics & Communication Engineer | Recent Graduate*

Bengaluru, Karnataka, India
Chennai, Tamil Nadu, India





Bachelor of Engineering, Electrical, Electronics and Communications Engineering
ARJUN COLLEGE OF TECHNOLOGY

INTERMEDIATE
MGM
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To obtain a challenging role in Electronics and Communication Engineering, utilizing skills in digital signal processing, communication systems, embedded systems and microcontrollers. Seeking to contribute to innovative projects and technologies in the field of ECE. Proficient in programming languages such as Python, C, and MATLAB. Looking to work with a team of professionals to design and develop cutting-edge electronic systems and solutions. Aiming to leverage my technical expertise to drive innovation and growth in the company
India
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openai
Trainee at ICLabs IN, Jul 2025 - Present · 1 yr 3 mos, Bengaluru, Karnataka, India, "I am currently a trainee in VLSI, specializing in Digital Physical Design. I am learning the complete flow from floorplanning, placement, CTS, routing to signoff. Passionate about semiconductor design and eager to build a strong career in chip implementation. Looking forward to applying my knowledge in real-world projects and contributing to cutting-edge technologies."
Trainee at ZF Commercial Vehicle Control Systems India Ltd, Mar 2025 - May 2025 · 3 mos, Chennai, Tamil Nadu, India
Design Internship at IC Labs, ❖ Physical design Flow implemented project: Picorv32 at 45nm (6424 Standard Cells, 7 Metal layers) based on PPA. ❖ Performed floor planning and power planning with rings/straps; achieved optimal core utilization and IR drop targets. ❖ Executed standard cell placement here analyzed cell congestion, density map and setup timing. ❖ Implemented Clock Tree Synthesis (CTS), reducing skew and latency for multi corner analysis. ❖ Completed global/detailed routing here analyzed types of routing congestion min spacing, min width, availability routing tracks. Checking DRC/LVS to support the signoff. ❖ Conducted Static Timing Analysis (STA) via Tempus: fixed setup/hold violations using VT swapping, buffering and cell sizing etc. For timing closure. ❖ In my design mostly optimized AREA and PERFORMANCE in 35 microns area in those tight constraints I achieved performance and I used techniques to satisfied the PPA.
Bachelor of Engineering, Electrical, Electronics and Communications Engineering, ARJUN COLLEGE OF TECHNOLOGY
INTERMEDIATE, MGM