Headline

Electrical Designer at Philips

About

Immediate Joiner Hardware Design Engineer with 7+ years of experience crafting embedded systems across medical, industrial automation, and IoT domains. I architect and develop end-to-end hardware—from electrical system architecture and hardware/software partitioning to schematic capture, layout, and compliance testing. Proficient in designing multi-layer, high-density PCBs with complex routing, controlled impedance, and high-voltage isolation. Specialized in mixed-signal, analog, and high-speed digital circuits involving ADCs, DACs, op-amp filters, impedance converters, and constant-current sources. Strong knowledge of PCB stack-up, signal integrity (SI), power integrity (PI), creepage/clearance, and thermal management. Hands-on with Battery Management Systems (BMS), Power Distribution Units (PDU), USB-C Power Delivery, Power Management ICs (PMICs), AC-DC and DC-DC converters, PDNs, LDOs, and energy-efficient systems. Skilled in LED driver design, heater control loops, low-noise analog front ends, and motor control electronics. Expert in PCB tools: Altium Designer, OrCAD Capture CIS, KiCAD, Eagle, Allegro; and simulation platforms: PSpice, LTSpice, HyperLynx, MATLAB, Simulink. I generate Gerber files, BOMs, assembly drawings, and validate with DFM, DFA, and DFT guidelines. Board bring-up, ICT/FCT, debugging, and EVT/DVT testing are part of my core workflow. Worked extensively with CAN, RS485, UART, SPI, I2C, USB 3.0/2.0, BLE, HDMI, LVDS, Ethernet, MODBUS, and RF interfaces. Developed antenna systems with impedance matching using VNAs and protocol analyzers. Fluent in compliance standards: IPC-2221, UL, CE, RoHS, IEC 60601-1/1-2, and EMI/EMC mitigation. Proven experience in Engineering Change Orders (ECO/ECR), Agile PLM, Windchill, Jama Connect, DOORS, Jira, Git. Led cross-functional and global teams across electrical, mechanical, quality, and firmware. Delivered solutions using DOE, DMAIC, DFMEA, 8D, and FMEA methodologies for RCA, test optimization, and value engineering. Created SOPs, validation matrices, and documentation packages for regulatory bodies. Passionate about embedded hardware, sensor fusion, and building robust, manufacturable systems that push boundaries. Let's connect and build something groundbreaking.

Location

Pune/Pimpri-Chinchwad Area

AI stack

claude

gemini

notebooklm

obsidian

openai

Work experience

Electrical Designer at Philips, Sep 2025 - Present · 11 mos, Pune District, Maharashtra, India

Senior Hardware Design Engineer at Medtronic, Sep 2023 - Sep 2025 · 2 y, Bengaluru, Karnataka, India, • Managed the full hardware development lifecycle for the 'Solv' smart hemodialysis machine, from requirements and schematic design (OrCAD Captue CIS) to production qualification (EVT/DVT). • Oversaw hardware change management using Agile PLM, processing ECRs/ECOs to maintain a compliant Design History File (DHF) for medical device regulations. • Designed and verified critical electro-mechanical subsystems, including fluidic controls, thermal regulation, and multi-modal sensor arrays (flow, pressure, conductivity). • Executed multi-layer PCB design (Allegro, KiCAD) and pre-layout simulation (PSpice, LTSpice), implementing DFM/DFT strategies to ensure high-yield manufacturability. • Developed and deployed automated Functional Circuit Testers (FCTs) for PCBAs, reducing RMA handling time by 60% through enhanced production-line fault detection. • Led EMC/EMI compliance testing to IEC 60601-1-2 standards at TÜV, implementing RF shielding and filtering solutions to achieve first-pass success. • Engineered a closed-loop PID heater control system achieving precise thermal regulation (target 89°C in <30s) across universal AC voltages (95-240VAC). • Drove a proactive obsolescence program, qualifying 2+ alternates for EOL components to guarantee zero production disruptions. • Prototyped a novel ultrasonic flow sensor using a TI MSP430FR6047 and developed advanced signal processing algorithms for precise fluid velocity measurement. • Architected a high-sensitivity leak detection system using a Kelvin-sensing AFE with zero-drift op-amps (OPA333) and a 24-bit delta sigma ADC (AD1232) to achieve sub-millivolt accuracy. • Applied structured RCA methodologies (8D, Fishbone) to resolve complex hardware failures, improving overall electrical system reliability by over 25%. • Collaborated with global cross-functional R&D teams (Mechanical, Firmware, Quality) to streamline product development and ensure high-quality project execution.

Product Development Lead | Embedded System Engineer at BIODEFENSE, Dec 2021 - Aug 2023 · 1 yr 9 mos, Mumbai, Maharashtra, India, ● In-depth literature review (Research papers/patents) on Virulent action of 405nm, 60Ghz - 64Ghz FMCW Radar, Semiconductor physics of LEDs, Controlled driving of LEDs via LED Drivers, Colorimetry, Optics, Thermal Optimization of high-power LED Optical system, True Human Presences Detection system via Sensor Fusion of FMCW Radar +Analog PIRs + Analog Ultrasonic and its verification by YOLO based camera system, etc. ● Led & Designed a scalable Product Architecture (Hardware & Software) based on system requirements. ● Led a multi-disciplinary team of 6+ Engineers (Embedded Hardware / Firmware / Mechanical / Product Design / Optics) & 4+ Subject Matter Experts (SMEs for Radar DSP & Hardware / Colorimetry & Optics). ● Introduced AGILE methodology for efficient product development & task tracking using JIRA, Sprints & weekly SCRUM. 𐩒 Brainstorm with the team about design alternatives. 𐩒 Initiate and participate in technical design reviews. 𐩒 Converting complex multi-personnel execution work into manageable & trackable workflow. ● Vendor Management : Searching & Identifying vendors for sourcing components & materials. 𐩒 Working with external service vendors for the fabrication & assembly. ● Embedded Hardware Engineering responsibilities included Schematic Design, BOM generation & PCB Layout. 𐩒 Coordinate PCB fabrication, DFM, DFT, ICT, FCT, and assembly. 𐩒 Carrying out the Design Validation Test (DVT) analysis for different Interfaces on Board. 𐩒 Development of Firmware for the Board Bring-up. 𐩒 Preparation of Electrical and Reliability test procedures. 𐩒 Setting up the Design of Experiments (DOE) for the device and gathering data and validation. 𐩒 Testing for IEC 60601-1, IEC 60601-1-2 compliance & EMI/EMC, UL, CE, tests and certification through various Laboratories. 𐩒 Testing, Verification, validation, and troubleshooting of prototypes.

Embedded System Engineer at Epocare, Apr 2020 - Sep 2021 · 1 yr 6 mos, Mumbai, Maharashtra, India, Designed & tested calibration device, which calibrates the WHAP device before it can be used on different patients. - Designed & tested the PCB, which includes schematic capture, BOM generation, 3D modeling of PCB. - Wrote the Firmware of the device. - Designed & fabricated the device enclosure. - Design of experiment: Identifying colloidal solution which can scatter NIR electromagnetic wave and correlating the velocity of solution in calibration device with the statistical LSCI (laser speckle contrast imaging) data from WHAP device for verification and testing of the calibration device as a whole. Designed a wearable Bluetooth-enabled SpO2 ( pulse oximetry ) measurement and skin temperature sensing device. - Designed & tested the PCB, which includes schematic capture, BOM generation, 3D modeling of PCB. - Wrote the Firmware of the device, which includes the nRF Bluetooth stack. - Researched and designed the material stack for wearable application ( adhesion to human skin ) - Designed & fabricated the enclosure of the device and metal housing for the contact temperature sensor. - Design of experiment: collection of spo2 & temperature data from multiple wearable devices and its co-relation with perfusion data from WHAP device. Designed & tested Controller device, which is used for Dimming of NIR laser. - Designed & tested the PCB, which includes schematic capture, high-speed layout for the USB hub to support streaming from multiple cameras, BOM generation, 3D modeling of PCB. - Wrote the Firmware of the device. - Design of experiment: correlation between varying dimming frequency along with different camera exposure time and the generated speckle pattern from NIR laser diode resulting in the quality of the captured monochrome image.

ASPIRE GET Production at ACG World, Jul 2019 - Mar 2020 · 9 mos, Indore, Madhya Pradesh, India, Was tasked with reducing weight variation in the capsule manufacturing process which was done using the six sigma methodology (DMAIC). Before : RSD (Relative standard deviation) : 2.6% & Cp (Process capability) : 0.64 After : RSD (Relative standard deviation) : 1.8% & Cp (Process capability) : 0.95 Understood introduction of weight variation in the capsule manufacturing process, by studying the post and pre dipping process. Various parameters like moisture content, solid content, gel flow, viscosity, air temperature, humidity, velocity, and pressure were studied concerning weight variation. Conducted various trials where the wet film thickness of the dipped pin was found using image processing it was related to the specified single wall thickness. Variation in the Dip Bath construction (alignment, physical dimensions of fins of distribution tray) and its process parameters were also studied concerning weight variation. Dipping profile study & analysis was done and tried to make a dipping profile with the boundary conditions of the dip-coating theory. Also tried to co-relate the well-researched dip-coating theory ( which is widely used in the semiconductor manufacturing industry ) to the capsule manufacturing industry. Since the process through which the capsule is manufactured can be modeled and greatly improve upon using the existing theoretical model of dip coating theory and experimental trials were suggested which would include using PIV (particle image velocimetry) which used to study the instantaneous direction and velocity of the particles traveling in a container/pump with complicated geometry and laser profilometry which can be used to study the thin film thickness of wet capsules since the thickness of the film in the range of 80 to 110 microns. Suggested the technique of DSC (differential scanning calorimetry) to streamline the drying profile of wet thin-film capsules.

Embedded Engineer at PhyFarm, Dec 2017 - Jul 2019 · 1 y 7 mo, Mumbai, Researched & Designed and tested Industrial PC which is 6 layer board to host 200 pins DDR2 SODIMM Raspberry Pi Compute Module, employed high-frequency PCB design rules which included calculating track impedance, trace spacing, calculated layer stack-up, and di-electric thickness and material selection to maintain proper board capacitance and impedance, etc, for the layout of USB 2.0, HDMI, Audio, Ethernet, Wifi, GSM modules and routing their traces. The board has interfaces like Modbus, CAN, I2C, SPI, UART. Provided provision for Analog Input/Output and Digital Input/Output with Galvanic Isolation, designed a sophisticated protection circuit for the board to include ESD protection, Current Suppression, Reverse current protection, and Galvanic isolation. designed a dynamic power supply circuit so the input circuit can be anywhere between a minimum of 10.7 V to a maximum of 28.8 V. Researched & Designed and tested PhySense which is 4 layer PCB that is an IoT Edge-node, ultra-low power, battery-operated and solar-powered module. It can support multiple sensors (with different power and protocol requirements) to harvest environment data and log back to the server. Researched & Designed and tested a Wifi controlled 4 layer PCB that is used to control 4 stepper motors which are used to control peristaltic pump, applied layout techniques relevant to the motor driver PCB design and RF design, employed STMicroelectronics STM32F401RETx as MCU and SiliconLabs AMW007R as Wifi module, Toshibas TB67S249FTG as stepper motor driver IC which uses dynamic load profile tracking which helps to limit the excess current required to move the motor. Wrote the firmware using timer interrupts. Researched & Designed Industrial grade Electrical Conductivity(EC), pH, CO2 meter by employing proper Signal Integrity(SI), Electromagnetic Interference (EMI), and Power Integrity(PI) rules.

Education

Bachelor's degree, Mechatronics, Robotics, and Automation Engineering, SVKM's NMIMS Mukesh Patel School of Technology Management & Engineering