About
Results-driven Failure Analysis Engineer and Metallurgical & Materials Engineer with expertise in semiconductor device, package, and board-level failure analysis. Currently working as Assistant Manager – Failure Analysis in the Quality & Reliability department at Tata Electronics, supporting root cause investigations, yield improvement initiatives, and product reliability across SoCs, ICs, semiconductor packages, BMBs, and PCB assemblies. My experience spans both electrical and physical failure analysis, including investigation of DCR failures, leakage issues, interconnect-related failures, solder joint defects, metallization degradation, die attach issues, laminate defects, and package-level reliability concerns. I specialize in correlating electrical test data with physical, chemical, and structural characterization to identify failure mechanisms and drive corrective actions. I have hands-on expertise in advanced failure analysis and characterization techniques, including SEM-EDS, FIB-SEM, cross-section analysis, TEM, X-ray imaging, CSAM, FTIR, and various decapsulation methodologies. I actively contribute to customer-driven failure analysis, 8D problem solving, CAPA implementation, quality documentation, and cross-functional collaboration with process, manufacturing, reliability, test, and supplier engineering teams. I hold an M.Tech in Materials Engineering from the prestigious Indian Institute of Science, where my research focused on Ni-based superalloys, microstructural evolution, phase transformations, heat treatment optimization, and deformation mechanisms. My academic background also includes CALPHAD-based alloy design and phase equilibria simulations using Thermo-Calc, providing strong fundamentals in materials science, process development, and advanced characterization. Prior to Tata Electronics, I gained research experience at Gas Turbine Research Establishment and industrial exposure at Rashtriya Ispat Nigam Limited, building a solid foundation in materials processing, characterization, and performance evaluation. Areas of Interest • Semiconductor Failure Analysis & Reliability Engineering • Device, Package & Board-Level Characterization • Semiconductor Process, Yield & Quality Engineering • Materials Characterization & Process Development • Advanced Manufacturing (Semiconductor, Electronics & Aerospace) 📍 Open to Relocation 📧 bdheerajkumar1999@gmail.com
Work experience
Assistant Manager - Failure Analysis | Quality & Reliability at Tata Electronics, Sep 2025 - Present · 1 yr, Bangalore
Graduate Apprentice Trainee at Gas Turbine Research Establishment (Defense R & D Organisation), May 2022 - Dec 2022 · 8 mos, Bengaluru, Karnataka, India, Worked on further development Research projects in GTRE as a Graduate Apprenticeship Trainee
Quality Assurance & Technology Development at Rashtriya Ispat Nigam Limited (Rinl), Jul 2019 - Jul 2019 · 1 mo, Vishakhapatnam, Andhra Pradesh, India
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