Headline

Sr.Lead Engineer at Methode Electronics

About

Lead CAE Engineer with 8+ years of experience in Injection Molding Simulation, Plastic Product Development, and Tooling Optimization using Autodesk Moldflow and Moldex3D. Experienced in delivering simulation-driven solutions for Automotive, Medical Devices, Connectors, Lighting, Home Appliances, and Water Management products. Currently working with global engineering teams across North America, Europe, and Asia to optimize product designs, tooling concepts, and manufacturing processes. Expertise includes Fill, Pack, Cool, Warp, Fiber Orientation, Core Shift (FSI), Overmolding, Insert Molding, 2K Molding, and Hot Runner Systems. Key strengths: ✔ Autodesk Moldflow & Moldex3D ✔ DFM & Plastic Part Design Validation ✔ Injection Molding Process Optimization ✔ Tool Design & Hot Runner Selection ✔ Fiber-Filled Material Analysis ✔ Core Shift & Warpage Prediction ✔ Global Cross-Functional Collaboration ✔ Technical Leadership & Mentoring Passionate about leveraging simulation-driven engineering to reduce development costs, minimize tooling risks, and accelerate product launches.

Location

Bengaluru

AI stack

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Work experience

Senior Lead Engineer at Methode Electronics, Aug 2026 - Present · 3 mos, Bengaluru · Hybrid

Lead Engineer at Methode Electronics, Sep 2023 - Aug 2026 · 3 yrs, Bengaluru · Hybrid